Embedded World returns to Nuremberg as the premier venue for embedded‑systems professionals seeking the latest AI and ultra‑low‑power IoT innovations. Over three days, hardware makers, software developers, and solution providers converge to reveal new power‑management silicon, edge‑AI accelerators, and modular modules that enable intelligent devices to run at sub‑watt levels.
TSMC Partners with Schukat for Power‑Management Solutions
Taiwan Semiconductor (TSMC) joins forces with European distributor Schukat to present a broad portfolio of discrete power devices and protection technologies tailored for embedded and industrial applications. The joint booth highlights how advanced power‑management silicon supports AI‑enabled edge devices that must meet strict energy budgets while maintaining reliability and efficiency.
Ambiq Demonstrates SPOT‑Powered Edge AI
Ambiq showcases its Subthreshold Power Optimized Technology (SPOT®) platform, delivering extreme energy efficiency for next‑generation edge AI SoCs.
- Atomiq SoC – a forthcoming 12 nm processor that integrates a neural‑processing unit (NPU) and leverages SPOT to boost memory and compute capability without increasing power draw.
- Apollo SoC family – the current best‑selling line powering smart glasses, medical devices, industrial sensors, and more, with hundreds of millions of units deployed worldwide.
Live demos illustrate reduced power consumption, smaller memory footprints, and lower latency for models running on Ambiq’s neuralSPOT and Helia platforms. A technical session titled A Faster Runtime: Granular Optimization of Edge AI with Ambiq explores the mismatch between modern AI frameworks and hardware‑specific embedded systems.
MYIR Showcases AI‑Ready System‑on‑Modules
MYIR Electronics presents its latest system‑on‑modules (SOMs) designed for rapid integration into AI‑enabled IoT devices. The offerings emphasize modularity, scalability, and readiness for industrial and consumer applications, reinforcing demand for plug‑and‑play AI building blocks.
Industry Trends: AI and Ultra‑Low‑Power Convergence
The exhibition agenda highlights a growing focus on on‑device perception, boundary‑scan verification, and integrated solution selling. Together, power‑management silicon and AI accelerators drive the shift toward embedding sophisticated inference capabilities into ever‑smaller, energy‑constrained form factors.
Impact on Embedded Ecosystem
By delivering sub‑watt AI compute, manufacturers can reduce reliance on cloud processing, lower latency, and enhance data privacy—critical factors for regulated sectors such as automotive, healthcare, and smart‑city infrastructure. Collaborative booth models further streamline design support, shortening development cycles for OEMs adopting AI‑enabled components.
Future Outlook
Embedded World serves as a barometer for how the embedded community tackles the twin challenges of AI performance and energy efficiency. Attendees will witness concrete demonstrations of sub‑threshold AI silicon, modular SOMs, and testing tools that ensure reliability of increasingly complex edge systems, shaping product roadmaps for the next generation of intelligent, connected devices.
